Laser—Core Luminous

The thickness of thick glass cutting crack can be ≤ 15mm when the cutting crack is completed in one piece.

Bessel processing technology is adopted with small focus spot, small edge collapse and high efficiency.

Customized special high pulse energy (max: ≤ 2.5mj) laser processing has small thermal effect.

Support automatic loading and unloading for capacity expansion.

The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.

The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).

The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.

Simplex double suction cups (simultaneously loading and unloading).

High cutting precision.

Cutting dimensional accuracy<±5μm.

Cutting taper < 5μm.

Cutting edge thermal impact < 10 μm.

Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.

The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.

Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.

Efficient LED chip massive welding, yield up to 99.99% or more.

Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.

Closed loop temperature control, to ensure the stability of bonding temperature.

High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the process of welding repair.

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality. AOI system is optional to confirm the success rate of welding.

The zoom laser system can be used, proportionally scaling to accommodate different chip sizes.

Adapt Hymson independent developed laser device & special optical circle design to BSG laser doping.

According to customer requirement design　&　manufacture equipｍent to realize high productivity, high precision, high efficiency, lossless doping.

Precision visual position, high speed flexible transimission, fragment lower 0.02%

Adapt Hymson independent developed laser device & special optical circle integrated intelligence manufacturing technology.

Flexible graphic control,relize various shape with dot,line, dotted line and solid line

Ultra-fine line width, non-destructive slotting, micron level automatic positioning;

Safe and reliable,noiseless,lower pollution,standardized modular design, high compatibility and interchangeability.

Equipped with high-performance infrared, green or ultraviolet picosecond laser, power and pulse width can be adjusted, high processing efficiency, can process a variety of material products.

Marble base and high precision linear motor, full closed-loop feedback control, high precision, good stability.

Equipped with high precision CCD visual positioning system, can accurately identify and grab all kinds of marks, ensure the precision of processing position.

Professional marking software, support a variety of document formats, stable performance, easy to use.

Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.

Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).

Flexible PCB board, LCD, TFT marking, cutting, etc.

Metallic or nonmetallic coating removal.

Superior beam quality.

Fast heat dissipation and stable temperature inside the cavity.

Output different wavelength, different power and pulse width.

Maintenance-free, continuous use up to 20,000 hours.

The laser power output is stable and the spot quality is good.

Marking speed is fast, 2-3 times that of traditional models.

No operating system restrictions, easy to operate, fully closed optical path, stable and reliable, maintenance-free.

Super long life.

The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.

The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).

The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.

Simplex double suction cups (simultaneously loading and unloading).

High cutting precision.

Cutting dimensional accuracy<±5μm.

Cutting taper < 5μm.

Cutting edge thermal impact < 10 μm.

Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.

The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.

Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.

Efficient LED chip massive welding, yield up to 99.99% or more.

Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.

Closed loop temperature control, to ensure the stability of bonding temperature.

High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the process of welding repair.

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality. AOI system is optional to confirm the success rate of welding.

The zoom laser system can be used, proportionally scaling to accommodate different chip sizes.

It is used for removing the adhesive material after the Mini LED module is sealed and for dressing the solder pad after the crystallization of each process segment. It is compatible with products of different thicknesses and sizes.

With micron - level light spots, it can efficiently remove Mini LED packaging glue of all sizes without damaging adjacent chips and pads. The self - developed chip removal system creates a clean repair environment, significantly boosting the repair yield.