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Hymson Laser
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Products
OVERVIEW
Product Description
Micro LED Laser Mass Transfer Equipment
This equipment is applied to Micro LED mass transfer and repair processes, and it can achieve selective transfer of RGB chips of any size and pitch. It is also used for single chip transfer and defect repair in the repair process.
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Sample before transfer -
Sample after transfer
ADVANTAGE
Product Advantages
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Modular design, separation of loading & unloading mechanism and transfer module.
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Automated wafer replacement using a robotic arm, with an overall equipment accuracy of ±1 μm.
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Laser control system, High quality optical system, the spot uniformity≥95%.
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Basic Information
- Equipment Size：2250mm(L)*1850mm(W)* 2450mm(H)
- Maximum Stroke：X1/X2 Axis 400mm；YAxis 450mm
- Equipment Weight：3800Kg
- Processing Type：Laser Mass transfer of Micro Led chips
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Product Performance
- Repeatability Accuracy：±0.75μm
- Position Accuracy：±1μm
- Speed：≤500mm/s
- Z Axis Repeatability Accuracy：±1μm
- Z Axis Position Accuracy：±1.5μm
INQUIRY