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Hymson Laser
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Products
OVERVIEW
Product Description
Mini LED Fully Automatic Laser Removal Equipment
This equipment is applied in the manufacturing process of Mini LED panels, undertaking tasks like removing defective LED beads, conducting repairs on them, and eliminating adhesives.
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Before removing the glue -
After removing the glue
ADVANTAGE
Product Advantages
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It is used for removing the adhesive material after the Mini LED module is sealed and for dressing the solder pad after the crystallization of each process segment. It is compatible with products of different thicknesses and sizes.
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With micron - level light spots, it can efficiently remove Mini LED packaging glue of all sizes without damaging adjacent chips and pads. The self - developed chip removal system creates a clean repair environment, significantly boosting the repair yield.
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Basic Information
- Equipment Size：1324mm(L)*1574mm(W)*2137mm(H)
- Maximum Stroke：X Axis 450mm x Y Axis 710mm
- Equipment Weight：2500Kg
- Processing Type ：Laser removal
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Product Performance
- Repeatability Accuracy：±1.5μm
- Position Accuracy：±3μm
- Speed：≤500mm/s
- Z Axis Repeatability Accuracy：±1.5μm
- Z Axis Position Accuracy：±3μm
INQUIRY