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Hymson Laser
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Products
OVERVIEW
Product Description
Micro LED Intelligent Versatile Laser Removal Equipment
This equipment is used for the large volume bonding equipment of chips in the Micro LED module manufacturing process.
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Before laser repair→After laser crystal removal→After laser repai
ADVANTAGE
Product Advantages
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Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.
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The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.
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Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.
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Basic Information
- Equipment Size：长1500mmx宽1900mmx高2137mm
- Maximum Stroke：X Axis 450mm x Y Axis 1050mm
- Equipment Weight：3000Kg
- Processing Type：Laser Stripping
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Product Performance
- Repeatability Accuracy：±0.75μm
- Position Accuracy：±1μm
- Speed：≤500mm/s
- Z Axis Repeatability Accuracy：±0.75μm
- Z Axis Position Accuracy：±1μm
INQUIRY