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Hymson Laser
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Products
OVERVIEW
Product Description
Single Station Laser Cutting&forming Machine
The laser cutting and forming equipment is applicable to the cutting and forming of covering film (CVL), flexible plate (FPC), soft and hard combination plate (RF) and thin multilayer plate, as well as the windowing and capping of relevant auxiliary materials.
1/4
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Covering Film 1 -
Covering Film 2 -
FPC -
Air Phone
ADVANTAGE
Product Advantages
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The international first-class brand laser with good beam quality, small focusing spot and high cutting quality.
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High-precision, low-drift galvanometer system combined with the marble linear motor platform, the cutting accuracy can be micron level.
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After design and optimization of the sealed optical path, the laser power is more stable, which ensures the effects of cutting.
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CCD visual pre-scanning and automatic target grasping positioning, capable of a variety of visual positioning features, such as cross, solid circle, hollow circle, L-shaped right-angle side, etc.
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Professional laser control software, with dynamic expansion and contraction compensation, dynamic calculation capacity, friendly and beautiful interface, powerful and diverse functions, simple and convenient operation.
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Basic Information
- Machine dimension：L1710mm*W1380mm*H1678mm（excluding tricolor lamp）
- PCB、FPC dimension：650X550mm
- PCB thickness：<2mm
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Product Performance
- Laser type：UV picosecond, nanosecond, imported laser
- Laser wavelength：355nm
- Laser power：nanosecond (15W, 20W) picosecond (15W, 30W)
- Machining accuracy：±20μm
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Model classification
- HP –C650
INQUIRY