Solutions
Modern transportation tends to be convenient and smooth, economical and efficient, green and intensive, intelligent and advanced, safe and reliable, and so on. Hymson, as a laser and automation equipment integrated solution provider, provides a series of intelligent, low-cost, safe and reliable manufacturing solutions in the field of transportation.
- Body Sheet Metal Processing
- Automobile Electronic Module
- Automotive Display Module Solution
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Intelligent Solutions for The Body Sheet Metal Processing Industry
Hymson's 3D laser cutting solution is used for efficient and precise cutting of various heterogeneous sheet metal parts of the car body to achieve flexible production.
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Body Sheet Metal Processing
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Secondary CalibrationThe second calibration of the robot improves the positioning accuracy and the cutting efficiency.
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Motion Interpolation AlgorithmMotion interpolation algorithm, improve the precision of small circle cutting and the cutting quality.
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Multi-axis LinkageThrough the development of multi-axis linkage function of the robot arm, it can realize high efficient cutting of complex workpieces and easily meet diverse needs.
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Automobile Electronic Module Scheme
The automotive electronics industry is upgrading and iterating towards higher standards and lower costs. The technology application accumulation of Hymson for many years has provided many intelligent and high-standard production solutions for manufacturing automotive electronics.
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High precisionAdopts high-precision visual positioning system
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High qualityDifferent types of lasers can be equipped
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High efficiencyFull-line automatic production realizable
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Automotive Display Module Solution
Hymson's innovative process is widely used in automotive chips, instrument displays, central control screens, power semiconductors, automotive electronics and other products, providing laser and automation integrated solutions for the innovation of the automotive screen industry.
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High-performance lasersSelf-developed advanced laser, good beam quality
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Ultra-high machining accuracyHigh-precision micron-level motion platform integration to achieve micro-nano processing level
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Intelligent control systemFully automatic intelligent program is simple to set, stable with accuracy and high efficiency
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Autonomous optical designThe self-developed optical design capabilities can meet the needs of different application scenarios and form core competitiveness
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Main Products
Develop new production for transportation.Set up lighter, smarter and safer transportation production.
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Body Sheet Metal Processing
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Automobile Electronic Module
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Automotive Display Module Solution
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Auto PCB Laser Marking Machine-
Support MES, unmanned and digital workshop system docking.
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Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.
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Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.
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Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.
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Double Station Laser Cutting Machine-
Stress-free cutting avoids product damage caused by stress of material.
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Dust free and environmental friendly.
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The section of cutting surface is smooth and neat without burr and carbonization.
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Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.
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PCB/FPC Online Laser Cutting Machine-
No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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Auto Laser Cutting Machine-
No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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Plastic Laser Welding Machine-
Good sealing performance.
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Weld strength equal to or greater than the base material.
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Low power consumption, no noise, no consumables, no maintenance.
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Laser, visual, temperature measurement three - in - one welding joint.
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Auto PCB Laser Marking Machine
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Support MES, unmanned and digital workshop system docking.
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Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.
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Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.
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Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.
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View Products
Double Station Laser Cutting Machine
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Stress-free cutting avoids product damage caused by stress of material.
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Dust free and environmental friendly.
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The section of cutting surface is smooth and neat without burr and carbonization.
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Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.
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View Products
PCB/FPC Online Laser Cutting Machine
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No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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Auto Laser Cutting Machine
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No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View Products
Micro LED Laser Mass Transfer Machine-
This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.
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Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.
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The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.
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Automatic transfer of RGB chips.
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High Precision Laser Automatic Wafer Cutting Equipment-
Realize high-precision cutting of wafer brittle materials without chipping and cracks
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Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses
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Compatible with different types and sizes of products
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Partner
Hymson dedicated to optimize production efficiency and energy utilization with high efficiency and stablization manufacturing equipment for partner
