Laser—Core Luminous

The thickness of thick glass cutting crack can be ≤ 15mm when the cutting crack is completed in one piece.

Bessel processing technology is adopted with small focus spot, small edge collapse and high efficiency.

Customized special high pulse energy (max: ≤ 2.5mj) laser processing has small thermal effect.

Support automatic loading and unloading for capacity expansion.

Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes

Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads

Adapt Hymson independent developed laser device & special optical circle design to BSG laser doping.

According to customer requirement design　&　manufacture equipｍent to realize high productivity, high precision, high efficiency, lossless doping.

Precision visual position, high speed flexible transimission, fragment lower 0.02%

Adapt Hymson independent developed laser device & special optical circle integrated intelligence manufacturing technology.

Flexible graphic control,relize various shape with dot,line, dotted line and solid line

Ultra-fine line width, non-destructive slotting, micron level automatic positioning;

Safe and reliable,noiseless,lower pollution,standardized modular design, high compatibility and interchangeability.

Equipped with high-performance infrared, green or ultraviolet picosecond laser, power and pulse width can be adjusted, high processing efficiency, can process a variety of material products.

Marble base and high precision linear motor, full closed-loop feedback control, high precision, good stability.

Equipped with high precision CCD visual positioning system, can accurately identify and grab all kinds of marks, ensure the precision of processing position.

Professional marking software, support a variety of document formats, stable performance, easy to use.

Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.

Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).

Flexible PCB board, LCD, TFT marking, cutting, etc.

Metallic or nonmetallic coating removal.

Superior beam quality.

Fast heat dissipation and stable temperature inside the cavity.

Output different wavelength, different power and pulse width.

Maintenance-free, continuous use up to 20,000 hours.

The laser power output is stable and the spot quality is good.

Marking speed is fast, 2-3 times that of traditional models.

No operating system restrictions, easy to operate, fully closed optical path, stable and reliable, maintenance-free.

Super long life.

Stable performance, can work for a long time.

Support PLT, PCX, DXF, BMP and other files, directly use the SHX, TIF library.

Support industry 4.0 and intelligent manufacturing, and create a new production mode.

Small size, easy to integrate.

Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes

Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads

Equipped with high-performance infrared, green or ultraviolet picosecond laser, power and pulse width can be adjusted, high processing efficiency, can process a variety of material products.

Marble base and high precision linear motor, full closed-loop feedback control, high precision, good stability.

Equipped with high precision CCD visual positioning system, can accurately identify and grab all kinds of marks, ensure the precision of processing position.

Professional marking software, support a variety of document formats, stable performance, easy to use.

Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.

Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).

Flexible PCB board, LCD, TFT marking, cutting, etc.

Metallic or nonmetallic coating removal.

Superior beam quality.

Fast heat dissipation and stable temperature inside the cavity.

Output different wavelength, different power and pulse width.

Maintenance-free, continuous use up to 20,000 hours.

The laser power output is stable and the spot quality is good.

Marking speed is fast, 2-3 times that of traditional models.

No operating system restrictions, easy to operate, fully closed optical path, stable and reliable, maintenance-free.

Super long life.

Equipped with high-performance infrared, green or ultraviolet picosecond laser, power and pulse width can be adjusted, high processing efficiency, can process a variety of material products.

Marble base and high precision linear motor, full closed-loop feedback control, high precision, good stability.

Equipped with high precision CCD visual positioning system, can accurately identify and grab all kinds of marks, ensure the precision of processing position.

Professional marking software, support a variety of document formats, stable performance, easy to use.

Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.

Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).

Flexible PCB board, LCD, TFT marking, cutting, etc.

Metallic or nonmetallic coating removal.

Superior beam quality.

Fast heat dissipation and stable temperature inside the cavity.

Output different wavelength, different power and pulse width.

Maintenance-free, continuous use up to 20,000 hours.

The laser power output is stable and the spot quality is good.

Marking speed is fast, 2-3 times that of traditional models.

No operating system restrictions, easy to operate, fully closed optical path, stable and reliable, maintenance-free.

Super long life.

Stable performance, can work for a long time.

Support PLT, PCX, DXF, BMP and other files, directly use the SHX, TIF library.

Support industry 4.0 and intelligent manufacturing, and create a new production mode.

Small size, easy to integrate.

Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes

Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads

Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes

Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads