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Hymson Laser
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Products
OVERVIEW
Product Description
Auto PCB Laser Removal Machine
Mainly used to remove the UV glue and waterproof film on the surface of PCB products on the SMT line. The principle to focus laser beam on material surface, causing physical or chemical changes on the material surface, so as to remove the UV glue and waterproof film.
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Before Removal -
After Removal -
Before Removal -
After Removal -
PCB Board -
Laptop -
Electronic Watch -
Earpods
ADVANTAGE
Product Advantages
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Equipped with high-performance CO2 laser and UV picosecond laser. The power and frequency are adjustable.
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The X/Y/Z module with high speed and high precision motion and with side-axis moving platform can be used for large scale machining
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Linear motor and optical ruler are used to drive the processing platform in a closed loop. Easy to maintain. Equipped with high-precision camera. High positioning accuracy. High removal accuracy
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Adopt marble precision platform, stable bearing, corrosion resistant, equipped with auto loading&unloading structure, reduce manual operation, and greatly increase production capacity.
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With professional HMI software, standard SMEMA interface. Supports multiple product files, multi-language timely switching, remote control and data upload, etc.
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Basic Information
- Size：W880 x D1700 x H1840mm
- PCB dimension：50×50mm-280×350mm
- PCB thickness：0.5mm-6mm
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Product Performance
- Laser wavelength：10.6 μm/9.3 μm
- Laser type： CO2
- Repetition precision：±0.025mm
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Model classification
- HP-E350
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