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Hymson Laser
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Products
OVERVIEW
Product Description
Auto Laser Cutting Machine
Fully auto laser cutting equipment applicable to the cutting and formation of epoxy resin (PCB), flexible plate (FPC), soft and hard combination plate (RF).
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PCB Board 1 -
PCB Board 2 -
FG Board
ADVANTAGE
Product Advantages
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No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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Links to SMT whole line and board splitting. In the whole process, manipulator loads/unloads/places plate, no need for manual loading/unloading, saving headcounts.
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Basic Information
- Equipment size:L2750*W1650*H1700（without tricolor light）
- PCB、FPC dimension:350X280mm
- PCB thickness:<2mm
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Product Performance
- Laser type:Nanosecond, Picosecond, imported laser
- Laser wavelength:355nm/532nm
- Laser power:<100um
- Machining accuracy:±20μm
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Model classification
- HP–CA350
INQUIRY