High Precision Laser Automatic Wafer Cutting Equipment

Product Description

High Precision Laser Automatic Wafer Cutting Equipment

Used for wafer cutting in new display Mini LED chips, third-generation semiconductor materials, semiconductors and other fields

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    Glass Cutting
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    Wafer Cutting
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    Chip Cutting

Product Advantages

  • Realize high-precision cutting of wafer brittle materials without chipping and cracks
  • Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses
  • Compatible with different types and sizes of products
  • Basic Information
    • Equipment size:length× width× height: 1869mm× 2201mm× 2274mm (excluding three-color lamp, dust collector, chiller)
    • Maximum stroke:X axis 300mm× Y axis 450mm× Z axis 60mm
    • Maximum processing size:150mm×150mm(6 inches)
    • Equipment weight:2.5t
    • Processed products: sapphire, glass, silicon wafer, GaN and other semiconductor materials
  • Product Performance
    • Positioning accuracy: ±1.5μm/300mm
    • Repeatability accuracy:±0.75μm
    • Processing speed:0.8m/s
    • Laser type/power:Picosecond laser/30w
    • Utilization rate:0.99
    • Yield:99.99%
  • Model classification
    • HR-WPG3B1

Sourcing Requirements

EV Battery
Smart Home
Life Sciences
Modern Building
Sheet-metal Working
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