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Hymson Laser
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Products
OVERVIEW
Product Description
High Precision Laser Automatic Wafer Cutting Equipment
Used for wafer cutting in new display Mini LED chips, third-generation semiconductor materials, semiconductors and other fields
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Glass Cutting -
Wafer Cutting -
Chip Cutting
ADVANTAGE
Product Advantages
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Realize high-precision cutting of wafer brittle materials without chipping and cracks
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Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses
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Compatible with different types and sizes of products
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Basic Information
- Equipment size:length× width× height: 1869mm× 2201mm× 2274mm (excluding three-color lamp, dust collector, chiller)
- Maximum stroke:X axis 300mm× Y axis 450mm× Z axis 60mm
- Maximum processing size:150mm×150mm(6 inches)
- Equipment weight:2.5t
- Processed products: sapphire, glass, silicon wafer, GaN and other semiconductor materials
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Product Performance
- Positioning accuracy: ±1.5μm/300mm
- Repeatability accuracy:±0.75μm
- Processing speed:0.8m/s
- Laser type/power:Picosecond laser/30w
- Utilization rate:0.99
- Yield:99.99％
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Model classification
- HR-WPG3B1
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