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Hymson Laser
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Products
OVERVIEW
Product Description
Mini LED Laser Soldering Repairing Equipment
This equipment is utilized in the Mini LED process rework to rebond repaired chips.
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Industry Application
ADVANTAGE
Product Advantages
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Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the process of welding repair.
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Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality. AOI system is optional to confirm the success rate of welding.
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The zoom laser system can be used, proportionally scaling to accommodate different chip sizes.
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Basic Information
- Equipment Size：1384mm(L)*1674mm(W)*1902mm(H)
- Maximum Stroke：X Axis 450mm x Y Axis 600mm
- Equipment Weight：2300Kg
- Processing Type：Laser welding repair
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Product Performance
- Repeatability Accuracy：±1μm
- Position Accuracy：±3μm
- Speed：≤500mm/s
- Z Axis Repeatability Accuracy：±1μm
- Z Axis Position Accuracy：±3μm
INQUIRY