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Hymson Laser
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Products
OVERVIEW
Product Description
Micro LED Mass Welding Equipment
This equipment is used for the large volume bonding equipment of chips in the Micro LED module manufacturing process.
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Before welding -
After welding
ADVANTAGE
Product Advantages
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Efficient LED chip massive welding, yield up to 99.99% or more.
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Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.
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Closed loop temperature control, to ensure the stability of bonding temperature.
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High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.
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Basic Information
- Equipment Size：3200mm(L)*2000mm(W)*2500mm(H)
- Maximum Stroke：X Axis 600mm x Y Axis 500mm
- Equipment Weight：6600Kg
- Processing Type ：Laser Soldering
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Product Performance
- Repeatability Accuracy ：±1μm
- Position Accuracy ：±2μm
- Speed ： ≤600mm/s
- Z Axis Repeatability Accuracy ：±1μm
- Z Axis Position Accuracy：±1.5μm
INQUIRY