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Hymson Laser
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Products
OVERVIEW
Product Description
Mini LED Mass Welding Equipment
This equipment is specialized for high volume chip soldering in the Mini LED module manufacturing process.
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Before Welding -
After Welding -
Mini LED direct display
ADVANTAGE
Product Advantages
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Highly efficient LED chip mass bonding with a yield rate of 99.99% or higher.
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Large area, high-speed bonding, leading the industry in production efficiency.
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Closed-loop temperature control ensures bonding temperature stability.
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Basic Information
- Equipment Size：1680mm(L)*1840mm(W)*2030mm(H)
- Maximum Stroke：X Axis 600mm x Y Axis 500mm
- Equipment Weight：2000Kg
- Processing Type ：Laser Soldering
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Product Performance
- Repeatability Accuracy：±8μm
- Position Accuracy：±13μm
- Speed：≤800mm/s
- Laser type/power:infrared laser/4000W
- Z Axis Repeatability Accuracy：±10μm
- Z Axis Position Accuracy：20μm
INQUIRY