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Hymson Laser
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Products
OVERVIEW
Product Description
Mini LED Mechanical Chip Removal Equipment
This equipment is used in the repair process of Mini LED chips, the damaged chip is removed, and the subsequent re-solidification, repair and welding is performed.
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Industry Application
ADVANTAGE
Product Advantages
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Coaxial visual positioning system for high-precision positioning of chip placement.
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Accurately detects pad height, enabling repair of residual solder on the pad without pad damage.
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Offers flexible selection of laser or mechanical die ejection.
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Compatible with pre-film and post-film repair processes.
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Basic Information
- Equipment size：1700mm(L)*1400mm(W)*2200mm(H)
- Maximum stroke：X Axis 450mm Y Axis 600mm
- Equipment Weight： 2300Kg
- Processing Type：Chip Removal
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Product Performance
- Repeatability Accuracy：±1.5μm
- Position Accuracy：±3μm
- Speed：≤500mm/s
- Z Axis Repeatability Accuracy：±3μm
- Z Axis Position Accuracy：20μm
INQUIRY