Fully Automatic Chip Removal Equipment

Product Description

Fully Automatic Chip Removal Equipment

Used in the repair process of mini LED chips, removing damaged chips for subsequent re-solidification and repair soldering

  • weibiaoti10000wulituijingji3-711.png
  • 209.jpg
    Chip Remove

Product Advantages

  • Coaxial visual positioning system, high-precision positioning chip position
  • Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad
  • Flexibly select laser or mechanically remove chips
  • Basic Information
    • Equipment size:length× width× height: 1700mm× 1400mm× 2200mm (excluding three-color lamp, dust collector, chiller)
    • Maximum stroke: X axis 450mm× Y axis 600mm× Z axis 60mm
    • Maximum processing size: 400mm×300mm
    • Equipment weight:1.5t
    • Processed products: Mini LED and related peripheral products
  • Product Performance
    • Positioning accuracy:±3μm
    • Repeatability accuracy:±1.5μm
    • Processing speed: 10s/pcs
    • Laser type/power:Near-infrared laser/30W
    • Utilization rate:0.99
    • Yield: 99.9%
  • Model classification
    • HR-PCRP11

Sourcing Requirements

EV Battery
Smart Home
Life Sciences
Modern Building
Sheet-metal Working
I have read and fully agree to the Privacy of the Hymson Website.