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Hymson Laser
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Products
OVERVIEW
Product Description
Fully Automatic Chip Removal Equipment
Used in the repair process of mini LED chips, removing damaged chips for subsequent re-solidification and repair soldering
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Chip Remove
ADVANTAGE
Product Advantages
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Coaxial visual positioning system, high-precision positioning chip position
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Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad
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Flexibly select laser or mechanically remove chips
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Basic Information
- Equipment size:length× width× height: 1700mm× 1400mm× 2200mm (excluding three-color lamp, dust collector, chiller)
- Maximum stroke: X axis 450mm× Y axis 600mm× Z axis 60mm
- Maximum processing size: 400mm×300mm
- Equipment weight:1.5t
- Processed products: Mini LED and related peripheral products
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Product Performance
- Positioning accuracy:±3μm
- Repeatability accuracy:±1.5μm
- Processing speed: 10s/pcs
- Laser type/power:Near-infrared laser/30W
- Utilization rate:0.99
- Yield: 99.9%
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Model classification
- HR-PCRP11
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