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Hymson Laser
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Products
OVERVIEW
Product Description
Glass Cutting Machine
This machine is used for cutting brittle materials such as display panel protection cover, rear battery cover, camera/fingerprint identification sensor cover, power/volume button cover, filter/prism in camera module, etc.
ADVANTAGE
Product Advantages
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The thickness of thick glass cutting crack can be ≤ 15mm when the cutting crack is completed in one piece.
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Bessel processing technology is adopted with small focus spot, small edge collapse and high efficiency.
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Customized special high pulse energy (max: ≤ 2.5mj) laser processing has small thermal effect.
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Support automatic loading and unloading for capacity expansion.
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The linear motor is equipped with an optical ruler full closed-loop drive processing platform, which is easy to maintain and high in accuracy.
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The cutting software independently developed is easy to process and operate.
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Basic Information
- Machine dimension：long × wide × Height: 2000mmX2600mmX2000mm (excluding tricolor lamp, display, dust remover and water cooler)
- Size of components used:compatible size range max ≤ 600x700mm (single side)
- Production site space:long × wide × Height: 3600 × 3000 × 2500
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Product Performance
- Cutting accuracy:≤±0.02mm（related to the actual situation of glass incoming materials）
- Cutting thickness:≤15mm
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Model classification
- HP-NA0801
INQUIRY