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Hymson Laser
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Products
OVERVIEW
Product Description
Automation PERC Laser Groove Machine
Laser grooving technology is to drill holes or grooves on the back of silicon wafer with laser. Revealed silicon substrate via drill through AlOx (SiOx) and SiNx thin films , and the back electric field is in contact with the silicon substrate through the holes or grooves on the thin film.
ADVANTAGE
Product Advantages
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Adapt Hymson independent developed laser device & special optical circle integrated intelligence manufacturing technology.
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Flexible graphic control,relize various shape with dot,line, dotted line and solid line
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Ultra-fine line width, non-destructive slotting, micron level automatic positioning;
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Safe and reliable,noiseless,lower pollution,standardized modular design, high compatibility and interchangeability.
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Matched Hymson independent laser, opitical path is completely closed and well sealed.
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Composed of the host and the connection station, the system can realize manual loading and unloading as well as automatic AGV loading and unloading,satisfying customer's varying loading requirements.
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Automation loading and unloading, batch production, unattended operation
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It can be directly connected to any brand of printer with high compatibility and flexibility.
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Basic Information
- Demension：Length×width×Height 5920mm×2620mm×2200mm(unincluding tricolor light, duster, cooling)
- Silicon wafer size：compatibility size 166/182/210/230
- Produce space：Length×width×Height 7000mm×3000mm×2500mm
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Product Performance
- Fragmentation rate：≤0.03%
- Graphic accuracy：±15um
- Alignment accuracy：±15um
- Capacity：≥6800pcs/h(210*210)
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Model classification
- HL-PPGCPD-HT
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