Support MES, unmanned and digital workshop system docking.

Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.

Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.

Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.

Stress-free cutting avoids product damage caused by stress of material.

Dust free and environmental friendly.

The section of cutting surface is smooth and neat without burr and carbonization.

Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.

No dust. Minor pollution to the environment

The cut surface section is smooth without burr and carbonization.

Non-stress cutting. Can avoid product damage caused by material stress.

Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.

No dust. Minor pollution to the environment

The cut surface section is smooth without burr and carbonization.

Non-stress cutting. Can avoid product damage caused by material stress.

Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.

Equipped with high-performance infrared, green or ultraviolet picosecond laser, power and pulse width can be adjusted, high processing efficiency, can process a variety of material products.

Marble base and high precision linear motor, full closed-loop feedback control, high precision, good stability.

Equipped with high precision CCD visual positioning system, can accurately identify and grab all kinds of marks, ensure the precision of processing position.

Professional marking software, support a variety of document formats, stable performance, easy to use.

Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.

Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).

Flexible PCB board, LCD, TFT marking, cutting, etc.

Metallic or nonmetallic coating removal.