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Hymson Laser
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Products
3C Battery
Power/Transformer
VCM
Electronic Atomization
PCB/SMT
Precision Structural Parts
Brittle Material
Dispensing
New Display
Laser
- Laser Cutting
- Laser Beam Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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Glass Cutting Machine-
The thickness of thick glass cutting crack can be ≤ 15mm when the cutting crack is completed in one piece.
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Bessel processing technology is adopted with small focus spot, small edge collapse and high efficiency.
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Customized special high pulse energy (max: ≤ 2.5mj) laser processing has small thermal effect.
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Support automatic loading and unloading for capacity expansion.
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Mini LED/Micro LED Fully Automatic Laser Repair、 Removal and Trimming Equipment-
Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes
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Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads
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