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Hymson Laser
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Products
Body Sheet Metal Processing
Automobile Electronic Module
Automotive Display Module Solution
Laser Plastic Welding
Laser
- Laser Cutting
- Laser Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
- Laser Plastic Welding
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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View ProductsDouble Station Laser Cutting Machine-
Stress-free cutting avoids product damage caused by stress of material.
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Dust free and environmental friendly.
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The section of cutting surface is smooth and neat without burr and carbonization.
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Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.
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View ProductsPCB/FPC Online Laser Cutting Machine-
No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View ProductsAuto Laser Cutting Machine-
No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View Products3D Laser cutting machine-
Adopt robot + fiber laser 3D cutting instead of die stamping and mechanical engraving and milling for cutting edge punching of shaped pipe fittings.
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Effective save moulds, shorten the product development cycle, improve processing efficiency and achive fexible production.
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Realize ring cutting, save the time of indexing machine rotation or manual secondary clamping, high efficient processing.
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Can be equipped with dual robot workstations to realize dual-station material change and linked cutting at the same time, the cutting efficiency has greatly improved.
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View ProductsComposite Film Laser Cutting Equipment-
High cutting precision.
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Cutting dimensional accuracy<±5μm.
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Cutting taper < 5μm.
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Cutting edge thermal impact < 10 μm.
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View ProductsBrittle Material Cutting Equipment-
The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.
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The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).
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The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.
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Simplex double suction cups (simultaneously loading and unloading).
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