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Hymson Laser
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Products
Body Sheet Metal Processing
Automobile Electronic Module
Automotive Display Module Solution
Laser
- Laser Cutting
- Laser Beam Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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View ProductsDouble Station Laser Cutting Machine
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Stress-free cutting avoids product damage caused by stress of material.
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Dust free and environmental friendly.
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The section of cutting surface is smooth and neat without burr and carbonization.
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Applicable for the cutting of soft and hard bonding plates, with high precision for plate splitting.
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View ProductsPCB/FPC Online Laser Cutting Machine
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No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View ProductsAuto Laser Cutting Machine
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No dust. Minor pollution to the environment
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The cut surface section is smooth without burr and carbonization.
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Non-stress cutting. Can avoid product damage caused by material stress.
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Applicable to cutting soft and hard combination plates. The accuracy of plate splitting is high.
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View Products3D Laser cutting machine
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Adopt robot + fiber laser 3D cutting instead of die stamping and mechanical engraving and milling for cutting edge punching of shaped pipe fittings.
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Effective save moulds, shorten the product development cycle, improve processing efficiency and achive fexible production.
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Realize ring cutting, save the time of indexing machine rotation or manual secondary clamping, high efficient processing.
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Can be equipped with dual robot workstations to realize dual-station material change and linked cutting at the same time, the cutting efficiency has greatly improved.
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View ProductsHigh Precision Laser Automatic Wafer Cutting Equipment
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Realize high-precision cutting of wafer brittle materials without chipping and cracks
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Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses
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Compatible with different types and sizes of products
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