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Hymson Laser
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Products
BAPV
BIPV
Elevator
Modern Business Display Technology
Security monitoring
UPS
Laser
- Laser Cutting
- Laser Beam Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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View ProductsAuto PCB Laser Marking Machine
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Support MES, unmanned and digital workshop system docking.
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Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.
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Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.
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Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.
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View ProductsDouble Station Uv Laser Marking Machine
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Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.
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Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).
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Flexible PCB board, LCD, TFT marking, cutting, etc.
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Metallic or nonmetallic coating removal.
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View ProductsGreen Laser Marking Machine
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Superior beam quality.
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Fast heat dissipation and stable temperature inside the cavity.
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Output different wavelength, different power and pulse width.
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Maintenance-free, continuous use up to 20,000 hours.
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View Products"Falcon" Series Laser Marking Machine Module
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Stable performance, can work for a long time.
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Support PLT, PCX, DXF, BMP and other files, directly use the SHX, TIF library.
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Support industry 4.0 and intelligent manufacturing, and create a new production mode.
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Small size, easy to integrate.
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View ProductsMicro LED Laser Mass Transfer Machine
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This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.
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Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.
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The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.
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Automatic transfer of RGB chips.
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View ProductsFully Automatic Chip Removal Equipment
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Coaxial visual positioning system, high-precision positioning chip position
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Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad
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Flexibly select laser or mechanically remove chips
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