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Hymson Laser
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Products
3C Battery
Power/Transformer
VCM
Electronic Atomization
PCB/SMT
Precision Structural Parts
Brittle Material
Dispensing
New Display
Laser
- Laser Cutting
- Laser Beam Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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View ProductsGlass Invisible Code Printing and Reading Machine
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It is used to mark the micron level QR code invisible to the human eye and recognized by the code reading device inside the glass/sapphire, and the single point size of the QR code is very small. Each piece of glass/sapphire sample can be marked with a two-dimensional code with unique information to provide traceability for the subsequent process, and has the function of anti-counterfeiting;
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Built-in turntable type multi-station carrier can realize loading, positioning, code reading and other functions;
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The QR code is generated inside the glass, and the subsequent glass surface treatment does not affect the effect of the second microcode;
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The minimum size of QR code can reach 100umx100um, and the success rate of reading code is more than 99.95%. Depth detection is optional.
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View ProductsMicro LED Laser Mass Transfer Machine
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This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.
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Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.
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The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.
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Automatic transfer of RGB chips.
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View ProductsFully Automatic Chip Removal Equipment
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Coaxial visual positioning system, high-precision positioning chip position
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Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad
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Flexibly select laser or mechanically remove chips
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View ProductsMini LED/Micro LED Fully Automatic Laser Repair、 Removal and Trimming Equipment
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Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes
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Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads
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