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Hymson Laser
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Products
3C Battery
Power/Transformer
VCM
Electronic Atomization
PCB/SMT
Precision Structural Parts
Brittle Material
Dispensing
New Display
Laser
- Laser Cutting
- Laser Beam Welding
- Laser Surface Treating
- Core Luminous
- Laser Control System
Automation
- Precision Assembly
- Machine Vision
- Roll-to-roll
Intelligent Manufacturing
- PLC Software Framework Platform
- PC Software Framework Platform
- Digital Twin
- Digital simulation
- Virtual commissioning
Basic Technology
- Advanced Testing
- Physical Simulation Computing Platform
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View ProductsLaptop Battery Pack Line
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Adopts industry's most advanced maglev conveying positioning technology to achieve fast and accurate positioning (complete 400mm station spacing in 0.8 seconds, positioning accuracy can reach μ grade).
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Modular processing module, integrated transmission line. Can conduct quick adjustment and expansion of station.
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Mainly includes battery assembly, laser welding, dispense heat conduction silica gel, conduction test, code spraying, labeling/packaging Label, labeling Mylar, PPG thickness detection, finished product testing, etc.
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The MES system controls production in fully closed-loop. The whole line can be equipped with digitalization to observe various indicators of the line in real time.
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View ProductsAuto Soft Pack Battery Pack Line
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Mainly includes pad printing, inkjet printing, pole ear cutting, pole ear size detection, grooving glue, PCM assembly/welding, pole ear bending, pole ear adhesive, glue wrapping, Pogo pin test, appearance inspection
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The equipment adopts single station single rack mode. Has high agility
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The MES system controls production in fully closed-loop. The whole line can be equipped with digitalization to observe various indicators of the line in real time.
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View ProductsAuto Assembly Line for Steel Shell Button Battery
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Most comprehensive experience in button battery pack technology in the industry. The equipment is compatible with various types of nickel sheet mounting and welding.
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Mainly include Busbar mounting, bending and welding, adhesive tape mounting, soft plate assembly and bending, laser welding, laser etching, Pogo pin, waterproof film removal, testing, liquid leakage and appearance inspection.
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The whole line adopts high-speed transmission line design, UPH > 1200. Seperated operation can be conducted by single machine and single process
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The MES system controls production in fully closed-loop. The whole line can be equipped with digitalization to observe various indicators of the line in real time.
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View ProductsGlass Cutting Machine
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The thickness of thick glass cutting crack can be ≤ 15mm when the cutting crack is completed in one piece.
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Bessel processing technology is adopted with small focus spot, small edge collapse and high efficiency.
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Customized special high pulse energy (max: ≤ 2.5mj) laser processing has small thermal effect.
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Support automatic loading and unloading for capacity expansion.
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View ProductsMicro LED Laser Mass Transfer Machine
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This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.
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Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.
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The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.
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Automatic transfer of RGB chips.
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View ProductsHigh Precision Laser Automatic Wafer Cutting Equipment
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Realize high-precision cutting of wafer brittle materials without chipping and cracks
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Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses
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Compatible with different types and sizes of products
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