Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.

The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.

Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.

Efficient LED chip massive welding, yield up to 99.99% or more.

Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.

Closed loop temperature control, to ensure the stability of bonding temperature.

High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.

Coaxial visual positioning system for high-precision positioning of chip placement.

Accurately detects pad height, enabling repair of residual solder on the pad without pad damage.

Offers flexible selection of laser or mechanical die ejection.

Compatible with pre-film and post-film repair processes.

Highly efficient LED chip mass bonding with a yield rate of 99.99% or higher.

Large area, high-speed bonding, leading the industry in production efficiency.

Closed-loop temperature control ensures bonding temperature stability.

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the process of welding repair.

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality. AOI system is optional to confirm the success rate of welding.

The zoom laser system can be used, proportionally scaling to accommodate different chip sizes.

High cutting precision.

Cutting dimensional accuracy<±5μm.

Cutting taper < 5μm.

Cutting edge thermal impact < 10 μm.