Suitable for capacity < Automatic assembly production of 350AH square cell to module.

It mainly includes cell loading cleaning and coating, stacking and strapping, pole addressing, pole laser cleaning, Busbar welding, collection line welding, DCR testing, EOL testing, PACK assembly, module unloading, etc.

Standardized, modular design, stable and reliable structure, processing efficiency up to 10~20PPM.

Line with flexible design, can be easily and quickly change the product vehicle and working procedure, in order to adapt to different product production. Single station and single process can be separated and run independently.

It is suitable for the automatic assembly production of large cylindrical aluminum shell cells to modules.

It mainly includes support processing, collection line welding, core charging, laser cleaning, sorting, core into support, pole addressing, laser welding side A, automatic flip, laser welding side B, PACK assembly, module assembly, etc., to complete automatic assembly from cylindrical cell to module.

The line efficiency can reach 20~30PPM.

MES system full closed-loop production control, optional whole line digitization, real-time observation of the line body indicators.

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the welding repair process

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality

Optional AOI system to instantly confirm welding success rate

Coaxial visual positioning system, high-precision positioning chip position

Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad

Flexibly select laser or mechanically remove chips

Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes

Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads

High-efficiency LED chip massive welding, yield can reach more than 99.99%

High-speed welding in large area, leading the industry production efficiency

Closed-loop temperature control to ensure bonding temperature stability