Modular design, separation of loading & unloading mechanism and transfer module.

Automated wafer replacement using a robotic arm, with an overall equipment accuracy of ±1 μm.

Laser control system, High quality optical system, the spot uniformity≥95%.

The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.

The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).

The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.

Simplex double suction cups (simultaneously loading and unloading).

It is used for removing the adhesive material after the Mini LED module is sealed and for dressing the solder pad after the crystallization of each process segment. It is compatible with products of different thicknesses and sizes.

With micron - level light spots, it can efficiently remove Mini LED packaging glue of all sizes without damaging adjacent chips and pads. The self - developed chip removal system creates a clean repair environment, significantly boosting the repair yield.

The machine body is welded with high-strength plates, to ensure that the machine tool has stable structure and it can stably operate for a long time.

Processing of the machine body adopts high-temperature treatment to maximum eliminate internal stress generated by the material and welding, and ensure high-strength, high-accuracy, and high tolerance.

The beam is made of high-intensity steel, which can reduce stress deformation, and ensure stable operation.

This part adopts high-intensity negative face adjustable support structure, which can be used to cut the material with the width of 200-3000mm.

The new side-hanging structure, automatic feeding mechanism, all-round breakthrough of processing efficiency.

Integral type precision chuck with standard dual-roller clamping jaw,highly improve the cutting accuracy.

Chuck stroke up to 120mm, processing range: round pipe 10-120mm; Square tube 10-80mm.

The brand new FSCUT 3000 professional tube cutting system integrates multiple tube cutting functions.

Realize high-precision cutting of wafer brittle materials without chipping and cracks

Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses

Compatible with different types and sizes of products