Coaxial visual positioning system for high-precision positioning of chip placement.

Accurately detects pad height, enabling repair of residual solder on the pad without pad damage.

Offers flexible selection of laser or mechanical die ejection.

Compatible with pre-film and post-film repair processes.

Highly efficient LED chip mass bonding with a yield rate of 99.99% or higher.

Large area, high-speed bonding, leading the industry in production efficiency.

Closed-loop temperature control ensures bonding temperature stability.

Mobile operating table, for easy operation.

Flexible application of single table, small footprint and high availability.

The mortise and tenon joint structure ensure the long-term stability of the machine.

Master6000S bus control system, deeply developed, easy to operate, intelligent and efficient.

Professional laser cutting machine with large range of pipe diameters and many types of processing, strong applicability.

The pneumatic, fully sealed, integral type chuck is more stable,with large clamping force, high machining precision and prominent effect of dust prevention,leading the industry.

Tube follow-up auxiliary support, effectively guarantee cutting accuracy.

Standard servo follow-up unloading, more accurate and efficient.

High production efficiency, double shift saving about 40 people.

Fast speed and strong stability, improve the product follow-up test link pass rate.

Standardized module design, can be adjusted at any time, expansion station or upgrade.

Production data is automatically saved and connected to the server.

Marble precision platform, stable bearing, corrosion resistance.

The machining platform is driven by linear motor and optical ruler in closed loop, which is easy to maintain and has high precision.

Infrared picosecond laser, small processing heat affected area, especially suitable for fine cutting.

Imported vacuum generator is adopted to ensure the stability of adsorption and positioning of products.