Laser—— Laser Surface treating

Large plate supporting structure on both sides

Highly accurate feeding unit

High-precision OCTO laser position adjustment system

High tension control accuracy enabled by multi-section electrode buffering system and tension control system; Compatible with A-A, A-B, B-B side ablation

Cantilever supporting structure with large plate on single side

Highly accurate feeding unit

Time-sharing laser ablation system

High tension control accuracy enabled by multi-section electrode buffering system and tension control system;

The machine adopts the simplex station single rack mode, and the number of freely assembled machine matches the UPH.

The machine adopts square welded frame+air spring roller type open and close door structure, with atmospheric appearance

The left and right products are switched with tool-free quick-change structure, and the production switching time of the left and right boards is less than 30min.

Precision laser cutting machine innovatively uses 2900W camera to accurately take photos and cut products, generate DWG graphics, 500W CCD secondary positioning, automatically correct the cutting position, maximize the efficiency of laser, cut the waterproof film without damaging the product.

Support MES, unmanned and digital workshop system docking.

Fiber laser is adopted, with good beam quality, strong material compatibility and fast processing speed.

Standard SMEMA interface and network communication function can communicate with upstream and downstream devices and servers.

High-precision CCD vision positioning, automatic offset compensation, and the equipment integrates laser coding and CCD code reading.

Support MES, unmanned and digital workshop system docking.

Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.

Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.

Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.

The efficiency of single/double head laser marking system has been greatly improved.

The support adopts the automatic loading and unloading method of clip or stack, and the loading, marking and detection can be performed separately.

Support MES, remote control and data upload; Unmanned, digital workshop system docking.

High-precision CCD visual positioning ensures the accuracy of marking position, and confirms the printing content and quality after marking.

Equipped with high-performance CO2 laser and UV picosecond laser. The power and frequency are adjustable.

The X/Y/Z module with high speed and high precision motion and with side-axis moving platform can be used for large scale machining

Linear motor and optical ruler are used to drive the processing platform in a closed loop. Easy to maintain. Equipped with high-precision camera. High positioning accuracy. High removal accuracy

Adopt marble precision platform, stable bearing, corrosion resistant, equipped with auto loading&unloading structure, reduce manual operation, and greatly increase production capacity.

This machine is applicable to glass surface cleaning, including but not limited to ink removal, PVD removal, etc. Such as camera hole, flash hole of mobile phone, ALS hole of notebook and PVD coating of front and rear cover can be removed

The turntable type dual-station processing platform can realize automatic online surface cleaning of dual-station, non-contact processing and pollution-free

CCD visual positioning module is used to selectively clean the glass surface. After cleaning, the glass transmittance reaches more than 90%, the glass substrate is not damaged, and the processing accuracy can be controlled within ± 0.02mm

Support MES, unmanned and digital workshop system docking.

Fiber laser is adopted, with good beam quality, strong material compatibility and fast processing speed.

Standard SMEMA interface and network communication function can communicate with upstream and downstream devices and servers.

High-precision CCD vision positioning, automatic offset compensation, and the equipment integrates laser coding and CCD code reading.

Adapt Hymson independent developed laser device & special optical circle design to BSG laser doping.

According to customer requirement design　&　manufacture equipｍent to realize high productivity, high precision, high efficiency, lossless doping.

Precision visual position, high speed flexible transimission, fragment lower 0.02%

Support MES, unmanned and digital workshop system docking.

Fiber laser is adopted, with good beam quality, strong material compatibility and fast processing speed.

Standard SMEMA interface and network communication function can communicate with upstream and downstream devices and servers.

High-precision CCD vision positioning, automatic offset compensation, and the equipment integrates laser coding and CCD code reading.

Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.

Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).

Flexible PCB board, LCD, TFT marking, cutting, etc.

Metallic or nonmetallic coating removal.

Superior beam quality.

Fast heat dissipation and stable temperature inside the cavity.

Output different wavelength, different power and pulse width.

Maintenance-free, continuous use up to 20,000 hours.

Stable performance, can work for a long time.

Support PLT, PCX, DXF, BMP and other files, directly use the SHX, TIF library.

Support industry 4.0 and intelligent manufacturing, and create a new production mode.

Small size, easy to integrate.

This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.

Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.

The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.

Automatic transfer of RGB chips.

Suitable for laser cleaning of square/cylindrical battery energy storage modules

Mainly includes visual positioning, pole laser cleaning

The equipment adopts on-line single-machine design, which can be operated independently or integrated into the production line

Easy maintenance, small footprint, short replacement time

Support MES, unmanned and digital workshop system docking.

Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.

Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.

Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.

Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.

Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).

Flexible PCB board, LCD, TFT marking, cutting, etc.

Metallic or nonmetallic coating removal.

Superior beam quality.

Fast heat dissipation and stable temperature inside the cavity.

Output different wavelength, different power and pulse width.

Maintenance-free, continuous use up to 20,000 hours.

Support MES, unmanned and digital workshop system docking.

Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.

Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.

Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.

Suitable for glass, polymer materials and other objects surface marking, micro - pore processing.

Widely used in food, medicine, cosmetics, wires and other polymer material packaging bottle (box) surface marking, punching microhole (_x0001_ aperture _x0001_d< 10μm).

Flexible PCB board, LCD, TFT marking, cutting, etc.

Metallic or nonmetallic coating removal.

Superior beam quality.

Fast heat dissipation and stable temperature inside the cavity.

Output different wavelength, different power and pulse width.

Maintenance-free, continuous use up to 20,000 hours.

Stable performance, can work for a long time.

Support PLT, PCX, DXF, BMP and other files, directly use the SHX, TIF library.

Support industry 4.0 and intelligent manufacturing, and create a new production mode.

Small size, easy to integrate.

This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.

Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.

The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.

Automatic transfer of RGB chips.

Coaxial visual positioning system, high-precision positioning chip position

Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad

Flexibly select laser or mechanically remove chips

Support MES, unmanned and digital workshop system docking.

Can be configured with high-performance CO2, optical fiber, green light and UV laser, and with adjustable power.

Easy to operate and can etch various patterns, characters, 2D codes, 1D codes and other contents.

Highly intelligent, high precision, strong system stability, true coaxial technology. Can conduct marking and reading immediately, and with faster efficiency.

This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.

Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.

The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.

Automatic transfer of RGB chips.

Coaxial visual positioning system, high-precision positioning chip position

Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad

Flexibly select laser or mechanically remove chips

Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes

Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads