Modular design, separation of loading & unloading mechanism and transfer module.

Automated wafer replacement using a robotic arm, with an overall equipment accuracy of ±1 μm.

Laser control system, High quality optical system, the spot uniformity≥95%.

It is used for removing the adhesive material after the Mini LED module is sealed and for dressing the solder pad after the crystallization of each process segment. It is compatible with products of different thicknesses and sizes.

With micron - level light spots, it can efficiently remove Mini LED packaging glue of all sizes without damaging adjacent chips and pads. The self - developed chip removal system creates a clean repair environment, significantly boosting the repair yield.

Realize high-precision cutting of wafer brittle materials without chipping and cracks

Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses

Compatible with different types and sizes of products

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the welding repair process

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality

Optional AOI system to instantly confirm welding success rate

Coaxial visual positioning system, high-precision positioning chip position

Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad

Flexibly select laser or mechanically remove chips

Highly efficient LED chip mass bonding with a yield rate of 99.99% or higher.

Large area, high-speed bonding, leading the industry in production efficiency.

Closed-loop temperature control ensures bonding temperature stability.