Good sealing performance.

Weld strength equal to or greater than the base material.

Low power consumption, no noise, no consumables, no maintenance.

Laser, visual, temperature measurement three - in - one welding joint.

Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.

The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.

Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.

Efficient LED chip massive welding, yield up to 99.99% or more.

Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.

Closed loop temperature control, to ensure the stability of bonding temperature.

High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the process of welding repair.

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality. AOI system is optional to confirm the success rate of welding.

The zoom laser system can be used, proportionally scaling to accommodate different chip sizes.

Modular design, separation of loading & unloading mechanism and transfer module.

Automated wafer replacement using a robotic arm, with an overall equipment accuracy of ±1 μm.

Laser control system, High quality optical system, the spot uniformity≥95%.

It is used for removing the adhesive material after the Mini LED module is sealed and for dressing the solder pad after the crystallization of each process segment. It is compatible with products of different thicknesses and sizes.

With micron - level light spots, it can efficiently remove Mini LED packaging glue of all sizes without damaging adjacent chips and pads. The self - developed chip removal system creates a clean repair environment, significantly boosting the repair yield.