The laser spot is less than 2μm, the working distance is 10.48mm, the chip cutting path width is 4μm~10μm, and the heat affected zone is less than 2μm.

The chip electrical conductivity yield is greater than 98%, single crystal rate is greater than 99%(single crystal spacing expansion deviation value can be as small as 10μm).

The cutting verticality is less than 2°, the minimum size can be cut 0204, the cutting thickness is 50~170μm.

Simplex double suction cups (simultaneously loading and unloading).

High cutting precision.

Cutting dimensional accuracy<±5μm.

Cutting taper < 5μm.

Cutting edge thermal impact < 10 μm.

Being used for Micro LED chip removal, welding and leveling compatible with different sizes of chips and substrates, leveling accuracy up to sub-micron level.

The chip glue of Micro LED as small as 5μm is removed by matching micron light spots, without damaging adjacent chips, pads and other layers.

Through the self-developed AI integration system, the repair location can be automatically identified to avoid the repair failure caused by misjudgment and ensure product safety.

Efficient LED chip massive welding, yield up to 99.99% or more.

Large area high-speed welding, compatible with larger substrate size, leading industry production efficiency.

Closed loop temperature control, to ensure the stability of bonding temperature.

High precision alignment leveling system, with leading vision algorithm, to ensure the high reliability of welding process.

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the process of welding repair.

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality. AOI system is optional to confirm the success rate of welding.

The zoom laser system can be used, proportionally scaling to accommodate different chip sizes.

Modular design, separation of loading & unloading mechanism and transfer module.

Automated wafer replacement using a robotic arm, with an overall equipment accuracy of ±1 μm.

Laser control system, High quality optical system, the spot uniformity≥95%.