This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.

Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.

The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.

Automatic transfer of RGB chips.

Realize high-precision cutting of wafer brittle materials without chipping and cracks

Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses

Compatible with different types and sizes of products

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the welding repair process

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality

Optional AOI system to instantly confirm welding success rate

Coaxial visual positioning system, high-precision positioning chip position

Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad

Flexibly select laser or mechanically remove chips

Used for the removal of rubber material after sealing of Mini LED module and the trimming of welding pads after decrystallization in each process section, which is compatible with products of different thicknesses and sizes

Matching micron-level light spot removes the chip encapsulant of micro LED as small as 5μm without damaging adjacent chips and welding pads

High-efficiency LED chip massive welding, yield can reach more than 99.99%

High-speed welding in large area, leading the industry production efficiency

Closed-loop temperature control to ensure bonding temperature stability