Good sealing performance.

Weld strength equal to or greater than the base material.

Low power consumption, no noise, no consumables, no maintenance.

Laser, visual, temperature measurement three - in - one welding joint.

Adopt robot + fiber laser 3D cutting instead of die stamping and mechanical engraving and milling for cutting edge punching of shaped pipe fittings.

Effective save moulds, shorten the product development cycle, improve processing efficiency and achive fexible production.

Realize ring cutting, save the time of indexing machine rotation or manual secondary clamping, high efficient processing.

Can be equipped with dual robot workstations to realize dual-station material change and linked cutting at the same time, the cutting efficiency has greatly improved.

This machine has automatic splicing and re-pitch function, which can transfer one or three color Micro led chip arrays of any size and pitch to target substrate.

Simultaneously compatible with mass transfer and repair processes, the yield of mass transfer is ≥99.99%, and the yield after repair is ≥99.99%.

The maximum size of the laser transfer product can reach 12.7inch, and the laser transfer accuracy is ≤±1.5μm, the laser transfer angle is ≤±1°.

Automatic transfer of RGB chips.

Realize high-precision cutting of wafer brittle materials without chipping and cracks

Hymson company self-developed cutting head to achieve cutting of glass of different thicknesses

Compatible with different types and sizes of products

Coaxial visual positioning system, high-precision positioning chip position, real-time monitoring of product status and effect in the welding repair process

Real-time monitoring of welding temperature, closed-loop temperature control, to ensure welding quality

Optional AOI system to instantly confirm welding success rate

Coaxial visual positioning system, high-precision positioning chip position

Accurate detection of welding pad height trims residual tin paste on the welding pad without damaging the welding pad

Flexibly select laser or mechanically remove chips